The ideas of design for manufacturability or design for assembility have been around for many years, but what do they mean for the electronics industry? In the early days, one of the main thrusts of these ideas was to keep things simple. While this is still important, as our products become smaller and more complex, a more important issue is seen as the ability to predict the outcomes of design and assembly. If it has to be complex, then let us at least know, on some scale, what we are in for.

This 2 day course revises the main concepts of these areas and then looks at a number of tools to assist participants in implementing these concepts. There are a number of good courses on some of the more well known tools, so these will be only reviewed and all of the tools will be put into context. Some of the lesser known tools will be covered in more detail. In particular, the course will cover in depth how to construct and use the PCB Design Report Card and the Assembly Report Card. These tools have been developed by Hewlett Packard and IBM respectively.


The tutorial is suitable for a wide range of personnel involved in manufacturing including factory managers, department managers, project leaders, quality personnel, supervisors, and conscientious operators who want to learn about the tools to assist them in being able to predict the outcome of their PCB design and assembly processes.


After completing this course, you will be able to:

NOTE: In order to get the maximum benefit from this course, attendees should know the different processes that their organisation is capable of providing in the bare board manufacturing or PCB assembly areas and the relative costs of these processes.



Vianney Shiel has extensive knowledge of printed circuit technology and CAD/CAM. His expertise is in design and production engineering. Professional experience has been gained through a combination of consultancy work to large electronics companies, research and being the founding director of a small design and manufacturing company. Vianney has visited more than 30 of the world’s largest electronics manufacturing sites to inspect their latest SMT design and manufacturing practices and has also been the co-chairman and presenter at the Surface Mount International Conference in San Jose, USA.