This 2 day course is designed to give participants a broad overview of PCB manufacturing technologies including the latest buildup technologies. Following this overview, the course looks at the design issues that effect the manufacturability and the ease of assembly of the board. Finally, the course examines the issues in bare board manufacture that will effect assembly. Special attention will be given to PCMCIA cards.

After having completed the course, you will be able to:

• Understand the main processes involved in PCB Fab for single , PTH and multilayer
• Appreciate the main different types of Build-up Technologies
• Understand the main processes involved in PCB Fab using Build-up Technologies
• The critical areas in PCB design which affect manufacturability
• The critical areas in PCB design which affect ease of assembly
• The critical areas in bare board manufacture which affect ease of assembly
• Appreciate the additional problems in design, manufacture and assembly of PCMCIA cards

• Overview of the main manufacturing steps in PCB Fab for single, PTH and multilayer
• Overview of Build-up Technologies
• Design criteria which make PCB’s more manufacturable
• Design criteria which make PCB’s easier to assemble
• PCB manufacturing problems which show up in assembly
• PCMCIA card problems in design, manufacture and assembly

This course is suitable for a wide range of personnel involved in PCB design, manufacture and assembly including factory managers, department managers, project leaders, quality personnel and supervisors who wish to gain an overview of current and future PCB Fab techniques and how these processes can be affected by design and how the processes can affect assembly

COURSE PRESENTER

Vianney Shiel has extensive knowledge of printed circuit technology and CAD/CAM. His expertise is in design and production engineering. Professional experience has been gained through a combination of consultancy work to large electronics companies, research and being the founding director of a small design and manufacturing company. Vianney has visited more than 30 of the world’s largest electronics manufacturing sites to inspect their latest SMT design and manufacturing practices and has also been the co-chairman and presenter at the Surface Mount International Conference in San Jose, USA.