This 2 day course is designed to give participants a broad overview of PCB manufacturing technologies including the latest buildup technologies. Following this overview, the course looks at the design issues that effect the manufacturability and the ease of assembly of the board. Finally, the course examines the issues in bare board manufacture that will effect assembly. Special attention will be given to PCMCIA cards.
After having completed the course, you will be able to:
This course is suitable for a wide range of personnel involved in PCB design, manufacture and assembly including factory managers, department managers, project leaders, quality personnel and supervisors who wish to gain an overview of current and future PCB Fab techniques and how these processes can be affected by design and how the processes can affect assembly
Vianney Shiel has extensive knowledge of
printed circuit technology and CAD/CAM. His expertise is in design and
production engineering. Professional experience has been gained through
a combination of consultancy work to large electronics companies, research
and being the founding director of a small design and manufacturing company.
Vianney has visited more than 30 of the world’s largest electronics manufacturing
sites to inspect their latest SMT design and manufacturing practices and
has also been the co-chairman and presenter at the Surface Mount International
Conference in San Jose, USA.